1.He aha ka PCB Electroplating?
ʻO ka PCB electroplating e pili ana i ke kaʻina hana o ka waiho ʻana i kahi papa o ka metala ma luna o ka ʻili o kahi PCB e hoʻokō ai i ka pilina uila, ka hoʻouna ʻana i ka hōʻailona, ka wela wela, a me nā hana ʻē aʻe. Hoʻopilikia ʻia ka DC electroplating maʻamau i nā pilikia e like me ka like ʻole o ka uhi ʻana, lawa ʻole ka hohonu o ka plating, a me nā hopena lihi, e paʻakikī ana e hoʻokō i nā koi hana o nā PCB kiʻekiʻe e like me nā papa High-Density Interconnect (HDI) a me Flexible Printed Circuits (FPC). ʻO nā lako mana hoʻololi kiʻekiʻe e hoʻohuli i ka mana AC nui i ka AC kiʻekiʻe, a laila hoʻoponopono ʻia a kānana ʻia e hana i ka DC paʻa a i ʻole pulsed. Hiki i kā lākou mau alapine hana ke hiki i ka ʻumi a i ʻole nā haneli kilohertz, ʻoi aku ma mua o ke alapine mana (50/60Hz) o nā lako mana DC kuʻuna. Hāʻawi kēia ʻano kiʻekiʻe-frequency i nā pono he nui i ka PCB electroplating.
2.Pono o High-Frequency Switching Power Supplies in PCB Electroplating
Hoʻomaikaʻi ʻia ka Coating Uniformity: ʻO ka "hopena ʻili" o nā au o nā alapine kiʻekiʻe ke kumu i ka manaʻo o kēia manawa ma luna o ka ʻili o ka mea alakaʻi, e hoʻomaikaʻi maikaʻi ana i ka like ʻana o ka uhi ʻana a me ka hōʻemi ʻana i nā hopena lihi. Pono kēia no ka hoʻopili ʻana i nā hale paʻakikī e like me nā laina maikaʻi a me nā micro-hole.
Hoʻonui i ka hiki ke hoʻopaʻa ʻia hohonu: hiki i nā ʻauwaʻa kiʻekiʻe ke komo i nā paia o ka lua, e hoʻonui ana i ka mānoanoa a me ka kūlike o ka plating i loko o nā lua, e kū ana i nā koi plating no ke kiʻekiʻe hiʻohiʻona vias.
Hoʻonui i ka Electroplating Efficiency: ʻO nā hiʻohiʻona pane wikiwiki o nā lako mana hoʻololi kiʻekiʻe e hiki ai i ka mana o kēia manawa, e hōʻemi i ka manawa plating a me ka hoʻonui ʻana i ka hana hana.
Hoʻemi i ka hoʻohana ʻana i ka ikehu: Loaʻa i nā lako mana hoʻololi kiʻekiʻe ka hoʻololi kiʻekiʻe a me ka hoʻohana haʻahaʻa haʻahaʻa, e kūlike me ke ʻano o ka hana ʻōmaʻomaʻo.
Hiki i ka Pulse Plating: Hiki ke hoʻopuka maʻalahi nā lako mana hoʻololi i ka manawa pulsed, hiki i ka pulse electroplating. Hoʻonui ka Pulse Plating i ka maikaʻi o ka uhi, hoʻonui i ka nui o ka uhi, hoʻemi i ka porosity, a hoʻemi i ka hoʻohana ʻana i nā mea hoʻohui.
3. Nā hiʻohiʻona o ka High-Frequency Switching Power Supply Applications in PCB Electroplating
A. Copper Plating: Copper electroplating ua hoʻohana ʻia i ka hana PCB e hana i ka papa conductive o ke kaapuni. Hāʻawi nā mea hoʻoponopono hoʻololi kiʻekiʻe i ka nui o kēia manawa, e hōʻoiaʻiʻo ana i ka waiho ʻana o ka papa keleawe like ʻole a hoʻomaikaʻi i ka maikaʻi a me ka hana o ka papa plated.
B. Lapaʻau ʻili: ʻO ka mālama ʻana o nā PCB, e like me ke gula a i ʻole ke kala kala, pono pū kekahi mana DC paʻa. Hiki i nā mea hoʻololi hoʻololi kiʻekiʻe ke hāʻawi i ka manawa kūpono a me ka volta no nā metala plating like ʻole, e hōʻoiaʻiʻo ana i ka maʻalahi a me ka pale ʻana i ka corrosion o ka uhi.
C. Chemical Plating: lawe ʻia ka hoʻoheheʻe kemika me ka ʻole o kēia manawa, akā he koi koʻikoʻi ke kaʻina no ka mahana a me ka nui o kēia manawa. Hiki i nā mea hoʻoponopono hoʻololi kiʻekiʻe ke hāʻawi i ka mana kōkua no kēia kaʻina hana, e kōkua ana i ka hoʻokele ʻana i nā uku plating.
4.Pehea e hoʻoholo ai i nā kikoʻī o ka PCB Electroplating Power Supply
ʻO nā kikoʻī o ka lako mana DC e koi ʻia no ka PCB electroplating e hilinaʻi ʻia i nā kumu he nui, me ke ʻano o ke kaʻina hana electroplating, ka nui o ka PCB, ka wahi plating, nā koi koi o kēia manawa, a me ka hana pono. Aia ma lalo kekahi mau ʻāpana koʻikoʻi a me nā kikoʻī lako mana maʻamau:
A. ʻO nā kikoʻī o kēia manawa
●Ka Density o kēia manawa: ʻO ka nui o kēia manawa no ka PCB electroplating maʻamau mai 1-10 A/dm² (ampere per square decimeter), ma muli o ke kaʻina hana electroplating (e like me ka hoʻoheheʻe keleawe, ka uhi gula, ka nickel plating) a me nā koi.
● Ka nui o nā koi o kēia manawa: Ua helu ʻia ka nui o nā koi o kēia manawa ma muli o ka wahi o ka PCB a me ka nui o kēia manawa. ʻo kahi laʻana:
⬛Inā he 10 dm² ka ʻāpana hoʻopaʻa PCB a ʻo ka mānoanoa o kēia manawa he 2 A/dm², ʻo ka nui o nā koi o kēia manawa he 20 A.
⬛No nā PCB nui a i ʻole ka hana nui ʻana, pono paha i nā haneli amperes a i ʻole nā mea kiʻekiʻe o kēia manawa.
Nā pae maʻamau o kēia manawa:
● Nā PCB liʻiliʻi a i ʻole ka hoʻohana ʻana i ke keʻena hana: 10-50 A
●Medium-nui PCB hana: 50-200 A
● Nā PCB nui a i ʻole ka hana nui: 200-1000 A a i ʻole
B.Voltage hoakaka
⬛PCB electroplating maʻamau e koi i nā voltage haʻahaʻa, maʻamau i ka laulā o 5-24 V.
⬛E pili ana i nā pono e like me ke kū'ē ʻana o ka ʻauʻau plating, ka mamao ma waena o nā electrodes, a me ka conductivity o ka electrolyte.
⬛No nā kaʻina hana kūikawā (e laʻa, ka pulupulu plating), pono paha nā pae uila kiʻekiʻe (e like me 30-50 V).
Nā pae Voltage maʻamau:
●Ka hoʻopalapala uila DC maʻamau: 6-12 V
●Pulse plating a i ʻole nā hana kūikawā: 12-24 V a i ʻole
Nā ʻano lako mana
●DC Power Supply: Hoʻohana ʻia no ka electroplating DC kuʻuna, e hāʻawi ana i kēia manawa paʻa a me ka uila.
●Pulse Power Supply: Hoʻohana ʻia no ka pulupulu electroplating, hiki ke hoʻopuka i nā ʻōhua pulsed kiʻekiʻe e hoʻomaikaʻi i ka maikaʻi o ka plating.
●High-Frequency Switching Power Supply: High efficiency and fast response, kūpono no nā koi electroplating kiʻekiʻe.
C. Mana Hoolako Mana
Hoʻoholo ʻia ka mana hāʻawi mana (P) e ka manawa (I) a me ka volta (V), me ke ʻano: P = I × V.
No ka laʻana, ʻo kahi lako mana e hoʻopuka ana i ka 100 A ma 12 V he mana o 1200 W (1.2 kW).
Kaulana mana maʻamau:
●Nā lako liʻiliʻi: 500 W - 2 kW
●Medium-nui lako: 2 kW - 10 kW
●Nā lako nui: 10 kW - 50 kW a i ʻole
Ka manawa hoʻouna: Feb-13-2025
